【其它測試項目及標準】:ASTM、UL等

【其它測試項目及標準】:ASTM、UL等
測試標準
測試項目（英文描述）
測試項目（中文描述）
ASTM D 149
Dielectric Breakdown Voltage & Strength
固體電絕緣材料在工頻下的介電擊穿電壓和介電強度
ASTM D 229
Bonding Strength
電氣絕緣用剛性薄板及板材的粘合強度
ASTM D 229
Dielectric Constant and Dissipation Factor
電氣絕緣用剛性薄板及板材的介電常數和介質損耗
ASTM D 229
Flexural Strength (Lengthwise & Crosswise)
電氣絕緣用剛性薄板及板材的彎曲強度
ASTM D 256
Izod Impact Test
測定塑料抗艾卓德擺動沖擊性
ASTM D 257
DC Resistance of Insulating Materials
絕緣材料的直流電阻或電導率
ASTM D 412
Tensile - Elastomer Properties (Test Method A)
硫化橡膠、熱塑橡膠和熱塑合成橡膠的拉伸試驗法
ASTM D 495
Arc Resistance
固體電氣絕緣材料的耐高壓小電流電弧性能
ASTM D 570
Water Absorption
塑料吸水率
ASTM D 638
Tensile Properties of Thermoplastic Materials
塑料抗拉特性
ASTM D 648
Deflection Temperature of Polymer Material Under Load
在撓曲負荷下塑料邊緣位置彎曲溫度的標準測試方法
ASTM D 648
Vicat Softening Point of Polymer Materials
塑料維卡(Vicat)軟化溫度的標準試驗方法
ASTM D 695
Compressive Strength
硬質塑料抗壓特性的標準試驗方法
ASTM D 790
Flexural Properties of Plastics
未增強和增強塑料及電絕緣材料的撓曲性的標準試驗方法
ASTM D 792
Specific Gravity of Polymers
用位移法測定塑料密度和比重(相關密度)的標準試驗方法
ASTM D 882
Tensile Strength - Thin Polymeric Sheeting (Bias or Machine Direction)
塑料薄板材抗拉特性的標準試驗方法
ASTM D 903
Bond Strength Properties of Adhesives - Peel Strength
膠粘劑抗剝落或剝離強度的試驗方法
ASTM D 1002
Bond Strength Properties of Adhesives - Lap Shear
用拉力負載法測定單面搭接粘結金屬試樣的表面剪切強度(金屬之間)
ASTM D 1042
Changes in Linear Dimensions of Polymer Materials
加速操作狀態下塑料線性尺寸變化的標準測試方法
ASTM D 1525
Vicat Softening Point of Polymer Materials
塑料維卡(Vicat)軟化溫度的標準試驗方法
ASTM D 1622
Density Determination of Foamed Polymer Material
硬質泡沫塑料表觀密度的標準試驗方法
ASTM D 1822
Tensile Impact Test
測試斷裂塑料及電絕緣材料拉伸沖擊能量的試驗方法
ASTM D 1830
Thermal Endurance of Flex by Curved Electrode
用弧形電極法測定電絕緣撓性薄片材料熱穩定性的標準試驗方法
ASTM D 1876
Bond Strength Properties of Adhesives - T-Peel
膠粘劑的抗剝離性的標準試驗方法(T 型剝離試驗)
ASTM D 2095
Bond Strength Properties of Adhesives - Butt Joint
用棒和條狀樣品測定膠粘劑抗拉強度的標準試驗方法
ASTM D 2584
Ignition Loss of Cured Reinforced Resins
固化的增強樹脂燃燒損失的標準試驗方法
ASTM D 3039
Tensile Properties of Polymer Matrix Composite Materials
聚合母體混合材料抗拉特性的標準試驗方法
ASTM D 3045
Heat Aging of Plastics Without Load
無負荷塑料制品熱老化的標準實施規程
ASTM D 3165
Strength Properties of Adhesives in Shear by Tension
用單面搭接迭層板裝配件的抗拉荷載法測定膠粘劑抗剪切強度的標準試驗方法
ASTM D 3386
Coefficient of Linear Thermal Expansion of ElectricalInsulating Materials
電絕緣材料的線性熱膨脹系數的標準試驗方法
ASTM D 3418
Differential Scanning Caloritmetry (DSC)
用差示掃描量熱法測定聚合物轉變溫度的標準試驗方法
ASTM D 3479
Tension Testing Fatigue of Polymer Matrix Composite Materials
聚合母體混合料拉伸疲勞度的標準試驗方法
ASTM D 3638
Comparative Tracking Index (CTI)
電絕緣材料比較漏電痕跡指數的標準試驗方法
ASTM D 3846
In-Plane Shear Strength of Reinforced Plastics
增強塑料的平面剪切強度的標準測試方法
ASTM D 3850
Thermal Gravimetric Analysis (TGA)
用熱解重量法測定固體電絕緣材料快速熱降解的標準試驗方法
ASTM D 3874
Hot Wire Ignition (HWI)
用電熱絲法測量材料著火性的標準試驗方法
ASTM D 5083
Tensile Properties of Reinforced Thermosetting Plastics
用于直邊樣品的熱增強塑料的拉伸性特性的標準試驗方法
ASTM B 193
Resistivity of Electrical Conductor Materials
導電體材料電阻率的標準測試方法
ASTM E 8
Tension Testing of Metallic Materials
金屬材料拉伸試驗的標準試驗方法
ASTM E 53
Copper Purity Analysis
用重量分析法測定非合金銅中銅含量的標準試驗方法
ASTM E 96
Water Vapor Transmission of Materials
材料的水蒸氣滲透性標準試驗方法
ASTM E 345
Tension Testing of Metallic Foils
金屬箔的抗拉試驗方法
ASTM E 1530
Thermal Conductivity
用保護的熱流計技術評定材料耐傳熱性能的標準試驗方法
GR-78-CORE
Surface Insulation Resistance (SIR) Telcordia
表面絕緣電阻
IEC 60695-2-11
Glow-Wire Flammability (Ignitability) for End sell 著火危險試驗.第 2-11 部分:
灼熱金屬線/專線的試驗方法.ZUI終產品的灼熱金屬線可燃性試驗方法
IEC 60695-2-12
Glow-Wire Flammability for Materials
材料的灼熱絲引燃試驗方法
IEC-60249
Base Materials for Printed Circuits
印制電路用基材
IEC-60326
Specification for Printed Circuits
印制電路規范
IEC-695-10-2
Ball Pressure Test
球壓試驗
IPC-4101
Specification for Base Materials for Rigid Multilayer Boards
剛性多層印制電路板基材規范
IPC-4103
Specification for Base Materials for High Speed/High Frequency App.
高速/高頻設備的基材規范
IPC-6012
Specification for Rigid Printed Boards
剛性印制板的鑒定與性能規范
IPC-6013
Specification for Flexible Printed Boards
撓性印制板的鑒定與性能規范
IPC-6016
Specification for High Density Interconnect (HDI) Layers or Boards
高密度互連層或板的鑒定和性能規范
IPC-6018
Microwave End Product Board Inspection and Test
微波終端產品板的檢驗和試驗規范
IPC-A-600
Acceptability of Printed Boards
印制板的驗收條件
IPC-SM-840
Qualification and Performance of Permanent Solder Mask
永久性阻焊劑的鑒定和性能
IPC-TM-650; Method 2.1.1.2
Microsectional Analysis
晶相切片, 半自動晶相切片設備(預備)
IPC-TM-650; Method 2.1.2
Pinhole Evaluation Dye Penetration Method
針孔評定,干燥滲透法
IPC-TM-650; Method 2.1.5
Surface Examination, Unclad and Metal Clad Material
未覆和覆金屬材料表面檢查
IPC-TM-650; Method 2.1.6.1
Glass Fabric Weight
纖維布重量
IPC-TM-650; Method 2.1.7
Thread Count
玻璃纖維布線數
IPC-TM-650; Method 2.1.10
Presence of Dicyandiamide Crystals
雙氰胺晶體目檢
IPC-TM-650; Method 2.1.13
Visual Inspection (Flex)
撓性印制電路材料夾雜物和空洞檢驗
IPC-TM-650; Method 2.2.1
Mechanical Dimensional Verification
機械結構確認
IPC-TM-650; Method 2.2.4
Dimensional Stability (Flex)
撓性電介質材料的結構穩定性
IPC-TM-650; Method 2.2.12
Thickness of Copper by Weight
銅箔厚度--稱重法
IPC-TM-650; Method 2.2.12.1
Overall Thickness and Profile Factor of Copper Foils
加工和未加工過的銅箔的全部厚度和外形因數
IPC-TM-650; Method 2.2.12.2
Weight and Thickness of C
免搬運銅箔的重量和厚度
IPC-TM-650; Method 2.2.12.3
Weight and Thickness of Copper Foils with Etchable Carriers
腐蝕性運輸下銅箔質量和厚度的確定
IPC-TM-650; Method 2.2.18
Determination of Thickness of Laminates by Mechanical Measurement
層壓板厚度機械測量法
IPC-TM-650; Method 2.2.18.1
Determination of Thickness of Metallic Clad Laminates, Cross-sectional
覆金屬層壓板厚度測定—橫截面法
IPC-TM-650; Method 2.3.1.1
Chemical Cleaning of Metal Clad Laminate
化學處理,材料的相應處理
IPC-TM-650; Method 2.3.1.1
Metal Surfaces Processability
覆金屬層壓板的化學清洗
IPC-TM-650; Method 2.3.2
Chemical Resistance (Flex)
撓性印制電路材料的耐化學性
IPC-TM-650; Method 2.3.3
Chemical Resistance of Materials
絕緣材料的耐化學性
IPC-TM-650; Method 2.3.4.2
Chemical Resistance of Laminates, Prepreg and Coated Foil sell, by Solvent
Exposure 層壓板、半固化片和鍍層產品的耐化學性—曝露于溶劑中
IPC-TM-650; Method 2.3.4.3
Chemical Resistance
基材的耐化學性—耐二氯甲烷
IPC-TM-650; Method 2.3.6
Etchability
過硫酸銨蝕刻法
IPC-TM-650; Method 2.3.9
Flammability of Prepreg and Thin Laminate
半固化片和薄層壓板的燃燒性
IPC-TM-650; Method 2.3.10
Flammability of Laminate
層壓板的燃燒性
IPC-TM-650; Method 2.3.10.1
Flammability of Soldermask on Printed Wiring Laminate
印制電路板用阻焊膜的燃燒性
IPC-TM-650; Method 2.3.15
Purity of Copper Foil
銅箔或鍍層的純度
IPC-TM-650; Method 2.3.16
Resin Content of Prepreg
半固化片的樹脂含量—灼燒法
IPC-TM-650; Method 2.3.16.2
Treated Weight of Prepreg
涂膠半固化片的重量
IPC-TM-650; Method 2.3.17
Resin Flow of Prepreg
半固化片的樹脂流動度
IPC-TM-650; Method 2.3.17.1
Resin Flow of Resin Coated Films (Flex)
涂膠膜和無支撐涂膠膜的樹脂流動度
IPC-TM-650; Method 2.3.17.2
Resin Flow of "No Flow" Prepreg
“不流動”半固化片的樹脂流動度
IPC-TM-650; Method 2.3.18
Gel Time of Prepreg
半固化片材料凝膠化時間
IPC-TM-650; Method 2.3.19
Volatile Content of Prepreg
半固化片揮發物含量
IPC-TM-650; Method 2.3.23
Soldermask Cure
熱固性阻焊劑的固化(耐久性)
IPC-TM-650; Method 2.3.25
Ionic Cleanliness
表面污染離子的探測和測量
IPC-TM-650; Method 2.3.37
Volatile Content
介質膜粘結劑的揮發物含量
IPC-TM-650; Method 2.3.38
Surface Organic Contaminant Detection Test
表面有機污染物的探測
IPC-TM-650; Method 2.4.1
Adhesion, Tape Testing
附著力—膠帶法
IPC-TM-650; Method 2.4.1.1
Adhesion, Marking Paints and Inks
標記油墨的附著力
IPC-TM-650; Method 2.4.1.5
Treatment Transfer (Treatment Integrity)
遷移處理的測定
IPC-TM-650; Method 2.4.1.6
Adhesion, Polymer Coating
聚合物涂層附著力
IPC-TM-650; Method 2.4.2.1
Flexural Fatigue and Ductility, Foil
金屬箔的彎曲疲勞和延展性
IPC-TM-650; Method 2.4.3
Flexural Fatigue, Flexible Printed Wiring
撓性印制電路材料的曲撓
IPC-TM-650; Method 2.4.3.1
Flexural Fatigue and Ductility, Flexible Printed Wiring
撓性印制電路材料的彎曲疲勞和延展性
IPC-TM-650; Method 2.4.4
Flexural Strength
層壓板彎曲強度(室溫下)
IPC-TM-650; Method 2.4.4.1
Flexural Strength (At Elevated Temperature)
層壓板彎曲強度(高溫下)
IPC-TM-650; Method 2.4.5
Flexural Endurance
撓性印制電路材料折彎試驗
IPC-TM-650; Method 2.4.5
Folding Flexibility
撓性印制電路材料折彎試驗
IPC-TM-650; Method 2.4.8
Peel Strength of Metallic Clad Laminates
覆金屬層壓板剝離強度
IPC-TM-650; Method 2.4.8.1
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)
金屬箔剝離強度(薄層壓板鎖眼試驗)
IPC-TM-650; Method 2.4.8.2
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)
高溫下覆金屬層壓板剝離強度(熱液體法)
IPC-TM-650; Method 2.4.8.3
Peel Strength (At Elevated Temperature in Air)
高溫下覆金屬層壓板剝離強度(熱空氣法)
IPC-TM-650; Method 2.4.8.4
Carrier Release, Thin Copper
銅箔的栽存試驗
IPC-TM-650; Method 2.4.9
Peel Strength (Flex)
撓性印制電路材料剝離強度
IPC-TM-650; Method 2.4.9.1
Peel Strength of Flexible Circuits - 11/98
撓性電路剝離強度
IPC-TM-650; Method 2.4.12
Solderability, Edge Dip Method
可焊性—邊浸法
IPC-TM-650; Method 2.4.13
Solder Float (Flex)
撓性印制電路材料耐浮焊性
IPC-TM-650; Method 2.4.13.1
Thermal Stress of Laminates
層壓板熱應力試驗
IPC-TM-650; Method 2.4.16
Initiation Tear Strength, Flexible Insulating Materials
撓性絕緣材料初始撕裂強度
IPC-TM-650; Method 2.4.18
Tensile Strength and Elongation @ Elevated Temperature
銅箔的拉伸強度和延伸率
IPC-TM-650; Method 2.4.18.1
Tensile/Elongation/Purity/Ductility
內部鍍層拉伸強度和延伸率
IPC-TM-650; Method 2.4.19
Tensile Strength and Elongation, Flexible Printed Wiring Materials
撓性印制電路拉伸強度和延伸率
IPC-TM-650; Method 2.4.21
Bond Strength Test, Unsupported Hole
非支撐孔連接盤粘合強度
IPC-TM-650; Method 2.4.21.1
Bond Strength Test (Surface Mount Lands)
粘合強度—表面貼裝盤的垂直拉脫法
IPC-TM-650; Method 2.4.22
Bow & Twist (PCB)
弓曲和扭曲
IPC-TM-650; Method 2.4.22.1
Bow and Twist (Laminate)
層壓板的弓曲和扭曲
IPC-TM-650; Method 2.4.24
Thermal Mechanical Analysis (TMA)
玻璃化溫度和 Z 向熱膨脹—TMA 法
IPC-TM-650; Method 2.4.24.1
Time to Delamination (TMA)
分層時間—TMA 法
IPC-TM-650; Method 2.4.24.3
Glass Transition Temperature of Organic Films
有機膜的玻璃化溫度—TMA 法
Glass Transition Temperature and Thermal Expansion of Materials Used In High
IPC-TM-650; Method 2.4.24.5
Density Interconnection (HDI) and Microvias -TMA Method
用于 HDI 和微孔材料的玻璃化溫度和熱膨脹系數—DMA 法
IPC-TM-650; Method 2.4.25
Differential Scanning Calorimetry (DSC)
玻璃化溫度和固化因素—DSC 法
IPC-TM-650; Method 2.4.27.2
Solder Mask Abrasion (Pencil Method)
阻焊膜耐摩擦—鉛筆法
IPC-TM-650; Method 2.4.28.1
Adhesion, Solder Resist (Mask), Tape Test Method
阻焊膜附著力—膠帶法
IPC-TM-650; Method 2.4.29
Adhesion, Solder Mask, Flexible Circuit
撓性電路阻焊膜附著力
IPC-TM-650; Method 2.4.36
Rework Simulation, Plated Through Holes
模擬返工—金屬化孔
IPC-TM-650; Method 2.4.38
Scaled Flow of Prepreg
半固化片比例流動度試驗
IPC-TM-650; Method 2.4.39
Dimensional Stability of Laminates
玻璃纖維增強薄層壓板尺寸穩定性
IPC-TM-650; Method 2.4.42.3
Wire Bond Pull Strength
導線結合拉脫強度
IPC-TM-650; Method 2.5.1
Arc Resistance
印制電路材料的耐電弧
IPC-TM-650; Method 2.5.3
Current Breakdown, Plated Through Holes
鍍通孔的耐電流
IPC-TM-650; Method 2.5.4.1
Conductor Temperature Rise Due to Current Changes in Conductors
導線電流變化期間的溫度升高
IPC-TM-650; Method 2.5.5.4
Dielectric Constant and Dissipation Factor of Printed Wiring Board
Material-Micrometer Method 印制電路板材料的介電常數和介質損耗—測微計法
IPC-TM-650; Method 2.5.5.9
Dielectric Constant (Permittivity) & Dissipation Factor (Loss Tangent) 1MHz～1.5GHz
下介電常數和介質損耗—平行板法
IPC-TM-650; Method 2.5.6
Dielectric Breakdown
剛性印制電路材料的介質擊穿
IPC-TM-650; Method 2.5.6.1
Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings
聚合阻焊膜和/或保護涂層的介電強度
IPC-TM-650; Method 2.5.6.2
Electric Strength of Printed Wiring Material
印制電路材料的電氣強度
IPC-TM-650; Method 2.5.7
Dielectric Withstanding Voltage (DWV)
印制板絕緣強度（DWV）試驗
IPC-TM-650; Method 2.5.7.1
Dielectric Withstanding Voltage - Polymeric Conformal Coating
電介質耐電壓—聚合保護涂層
IPC-TM-650; Method 2.5.14
Resistivity of Copper Foil
銅箔電阻率
IPC-TM-650; Method 2.5.17
Volume and Surface Resistivity (Flex)
印制電路材料的體積電阻率和表面電阻
IPC-TM-650; Method 2.5.17.1
Volume and Surface Resistivity
電介質材料的體積電阻率和表面電阻率
Volume Resistivity of Conductive Resistance Used in High Density Interconnection
IPC-TM-650; Method 2.5.17.2
(HDI) and Microvias, Two-Wire Method
HDI 和微孔板用傳導材料的體積電阻率—雙導線法
IPC-TM-650; Method 2.5.27
Surface Insulation Resistance test
半成品印制電路材料的表面絕緣電阻
IPC-TM-650; Method 2.6.1
Fungus Resistance (Non-Nutrient)
印制電路材料的耐霉菌試驗
IPC-TM-650; Method 2.6.2
Moisture Absorption, Flexible Printed Wiring
撓性印制電路吸濕性試驗
IPC-TM-650; Method 2.6.3
Moisture and Insulation Resistance
印制板的吸濕性和絕緣電阻
IPC-TM-650; Method 2.6.3.1
Moisture and Insulation Resistance - Solder Mask
阻焊膜的吸濕性和絕緣電阻
IPC-TM-650; Method 2.6.3.2
Moisture and Insulation Resistance, Flexible Base Dielectric
撓性絕緣基材的吸濕性和絕緣電阻
IPC-TM-650; Method 2.6.3.3
Surface Insulation Resistance (SIR)
表面絕緣電阻,溶劑
IPC-TM-650; Method 2.6.3.4
Moisture and Insulation Resistance – Conformal Coating
絕緣保護涂層的吸濕性和絕緣電阻
IPC-TM-650; Method 2.6.3.5
Bare Board Cleanliness by Surface Insulation Resistance
用表面絕緣電阻測定裸板清潔度
IPC-TM-650; Method 2.6.3.6
Surface Insulation Resistance - Fluxes – Telecommunications
表面絕緣電阻——微電流法
IPC-TM-650; Method 2.6.5
Physical Shock, Multilayer Printed Wiring
多層印制板的物理沖擊
IPC-TM-650; Method 2.6.6
Temperature Cycling, Printed Wiring Board
印制電路板的溫度循環
IPC-TM-650; Method 2.6.7
Thermal Shock and Continuity, Printed Board
印制板的熱沖擊和連續性
IPC-TM-650; Method 2.6.7.1
Thermal Shock--Polymer Solder Mask Coatings
絕緣保護涂層的熱沖擊
IPC-TM-650; Method 2.6.7.2
Thermal Shock, Continuity and Microsection, Printed Board
印制板的熱沖擊、連續性和晶相切片
IPC-TM-650; Method 2.6.7.3
Thermal Shock - Soldermask
阻焊膜的熱沖擊
IPC-TM-650; Method 2.6.8
Thermal Stress, Plated Through-Holes
鍍通孔的熱應力試驗
IPC-TM-650; Method 2.6.8.1
Thermal Stress, Laminate
層壓板的熱應力試驗
IPC-TM-650; Method 2.6.9
Vibration, Rigid Printed Wiring
剛性印制電路的振動試驗
IPC-TM-650; Method 2.6.11
Hydrolytic Stability/Aging
阻焊膜的水解穩定性
IPC-TM-650; Method 2.6.14
Resistance to Electrochemical Migration, Solder Mask
耐電遷移——阻焊膜
IPC-TM-650; Method 2.6.14.1
Electrochemical Migration Resistance Test
耐電遷移試驗
IPC-TM-650; Method 2.6.16
Pressure Vessel Thermal Stress
環氧玻璃布層壓板完整性——壓力容器法
IPC-TM-650; Method 2.6.21
Service Temperature of Flexible Printed Wiring
撓性印制電路的工作溫度
IPC-TM-650; Method 2.6.25
Conductive Anodic Filament Test (CAF)
陽極絲傳導試驗（CAF）
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
電子裝配和電氣焊接要求
J-STD-002
Solderability Tests for Component Leads, Terminations, and Wires
起斷、終端和金屬線結構的可焊性試驗
J-STD-003
Solderability Tests for Printed Boards
印制板可焊性試驗
MIL-P-50884
Printed Wiring Boards, Flexible or Rigid-Flex
撓性和剛-撓性印制線路板
MIL-P-55110
Printed Wiring Boards, Rigid
剛性印制線路板
MIL-PRF-31032
Printed Wiring/Circuit Board Performance Specification
印制線路/電路板性能規范
MIL-PRF-50884
Printed Wiring Boards, Flexible or Rigid-Flex
撓性或剛-撓性印制線路板
MIL-PRF-55110
Printed Wiring Boards, Rigid
剛性印制線路板
MIL-STD-1130
Wirewrap Bit Certification
導線卷繞位的驗證
UL 746A
Polymeric Materials - Short Term Properties
聚合物材料——短時性能評定
UL 746B
Polymeric Materials - Long Term Property Evaluations
聚合物材料——長時性能評定
UL 746C
Polymeric Materials - Use in Electronic Equipment Evaluations
電氣設備用聚合物材料的評定
UL 746D
Polymeric Materials - Fabricated Parts
聚合物材料——成品零部件
UL 746E
Polymeric Materials - Industrial Laminates and Materials
聚合材料——工業用層壓板、纖維纏繞管、硬化紙板及印制線路板用材料
UL 796
Printed Wiring Boards
印制線路板
UL 796F
Flexible Materials Interconnect Constructions
撓性材料互連結構
UL 94
Tests for Flammability of Plastic Materials
各種電氣裝置和設備中零部件用塑料材料燃燒性試驗
WS-6536
Tensile/Elongation/Purity/Ductility
拉伸/ 延伸/純度/延展性